Douglas M. Haines
Plus aucun poste en cours
Anciens postes connus de Douglas M. Haines
| Sociétés | Poste | Fin |
|---|---|---|
ChipPAC, Inc.
 ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | Directeur/Membre du Conseil | 31/10/2005 |
Expériences
Fonctions occupées
Sociétés liées
| Entreprise privées | 1 |
|---|---|
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | Electronic Technology |
