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Jin Aun Lew
Président chez Selangor Human Resources Development Centre
Fortune : 514 568 $ au 31/05/2024
Postes actifs de Jin Aun Lew
Sociétés | Poste | Début | Fin |
---|---|---|---|
Selangor Human Resources Development Centre | Président | - | - |
Historique de carrière de Jin Aun Lew
Anciens postes connus de Jin Aun Lew
Sociétés | Poste | Début | Fin |
---|---|---|---|
JF TECHNOLOGY | Directeur/Membre du Conseil | 02/01/2009 | 01/12/2022 |
Independent Dir/Board Member | 02/01/2009 | 01/12/2022 | |
STATS CHIPPAC LTD. | Directeur Général | - | - |
Motorola Solutions Malaysia Sdn. Bhd.
![]() Motorola Solutions Malaysia Sdn. Bhd. Telecommunications EquipmentElectronic Technology Part of Motorola Solutions, Inc., Motorola Solutions Malaysia Sdn. The company is based in Petaling Jaya, Malaysia. Bhd. is a Malaysian company that manufactures communication devices and equipment. | Directeur Général | - | - |
Formation de Jin Aun Lew
University of Malaya | Undergraduate Degree |
University of Bath | Masters Business Admin |
Statistiques
Internationale
Malaisie | 5 |
Singapour | 2 |
Royaume-Uni | 2 |
Opérationnelle
Chief Executive Officer | 2 |
Director/Board Member | 1 |
Independent Dir/Board Member | 1 |
Sectorielle
Electronic Technology | 4 |
Consumer Services | 3 |
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Sociétés liées
Sociétés cotées | 1 |
---|---|
JF TECHNOLOGY | Electronic Technology |
Entreprise privées | 3 |
---|---|
Selangor Human Resources Development Centre | |
Motorola Solutions Malaysia Sdn. Bhd.
![]() Motorola Solutions Malaysia Sdn. Bhd. Telecommunications EquipmentElectronic Technology Part of Motorola Solutions, Inc., Motorola Solutions Malaysia Sdn. The company is based in Petaling Jaya, Malaysia. Bhd. is a Malaysian company that manufactures communication devices and equipment. | Electronic Technology |
STATS ChipPAC Pte Ltd.
![]() STATS ChipPAC Pte Ltd. Electronic Equipment/InstrumentsElectronic Technology STATS ChipPAC Pte Ltd. engages in the provision of semiconductor test and packaging services. Its services includes design, characterization, and wafer bumping.The company was founded by June Lihan Chia in 1994 and is headquartered in Singapore. | Electronic Technology |
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