William Crockett
Corporate Officer/Principal chez Microbonds, Inc.
Profil
William Crockett is currently working as the Vice President-Business Development at Microbonds, Inc. since 2005.
He previously worked as a Principal at Statschippac Ltd.
and the US Department of the Navy (District of Columbia).
He completed his undergraduate degree at California Polytechnic State University (San Luis Obispo).
Postes actifs de William Crockett
| Sociétés | Poste | Début |
|---|---|---|
Microbonds, Inc.
 Microbonds, Inc. SemiconductorsElectronic Technology Microbonds, Inc. develops microchip interconnect solutions. It engages in the research and development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. The company was founded by John I. Persic and Robert Lyn in 1999 and is headquartered in Markham, Canada. | Corporate Officer/Principal | 01/01/2005 |
Anciens postes connus de William Crockett
| Sociétés | Poste | Fin |
|---|---|---|
Statschippac Ltd.
 Statschippac Ltd. SemiconductorsElectronic Technology Statschippac Ltd. provides semiconductor packaging design, assembly, testing, and distribution solutions. The private company is based in Fremont, CA. | Corporate Officer/Principal | - |
| US Department of the Navy (District of Columbia) | Corporate Officer/Principal | - |
Formation de William Crockett
| California Polytechnic State University (San Luis Obispo) | Undergraduate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Entreprise privées | 3 |
|---|---|
| US Department of the Navy (District of Columbia) | Government |
Microbonds, Inc.
Microbonds, Inc. SemiconductorsElectronic Technology Microbonds, Inc. develops microchip interconnect solutions. It engages in the research and development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. The company was founded by John I. Persic and Robert Lyn in 1999 and is headquartered in Markham, Canada. | Electronic Technology |
Statschippac Ltd.
Statschippac Ltd. SemiconductorsElectronic Technology Statschippac Ltd. provides semiconductor packaging design, assembly, testing, and distribution solutions. The private company is based in Fremont, CA. | Electronic Technology |
