![Zhi Yi Xiao](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Zhi Yi Xiao
Directeur/Membre du Conseil chez UNISEM (M)
Profil
Dr. Zhi Yi Xiao is a General Manager at Huatian Technology (Kunshan) Electronics Co. Ltd.
He is on the Board of Directors at Tianshui Huatian Technology Co., Ltd., Unisem (M) Bhd., FlipChip International LLC and Unisem Advanced Technologies Sdn.
Bhd.
Dr. Xiao was previously employed as a General Manager by Xiamen Yonghong Group Co. Ltd.
He received his MBA from Adelphi University and a doctorate degree from Fudan University.
Postes actifs de Zhi Yi Xiao
Sociétés | Poste | Début |
---|---|---|
UNISEM (M) | Directeur/Membre du Conseil | 30/01/2019 |
TIANSHUI HUATIAN TECHNOLOGY CO., LTD. | Directeur/Membre du Conseil | 21/05/2019 |
Huatian Technology (Kunshan) Electronics Co. Ltd.
![]() Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | Directeur Général | 01/01/2013 |
Unisem Advanced Technologies Sdn. Bhd.
![]() Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | Directeur/Membre du Conseil | - |
FlipChip International LLC
![]() FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Directeur/Membre du Conseil | - |
Anciens postes connus de Zhi Yi Xiao
Sociétés | Poste | Fin |
---|---|---|
Xiamen Yonghong Group Co. Ltd.
![]() Xiamen Yonghong Group Co. Ltd. SemiconductorsElectronic Technology Xiamen Yonghong Group Co., Ltd. manufactures and distributes semi conductor lead frames. It also provides precise tooling products. The company distributes products to United States and other European countries. Xiamen Yonghong Group is located in Xiamen, China | Corporate Officer/Principal | 01/01/2009 |
Formation de Zhi Yi Xiao
Fudan University | Doctorate Degree |
Adelphi University | Masters Business Admin |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
Sociétés cotées | 2 |
---|---|
UNISEM (M) | Electronic Technology |
TIANSHUI HUATIAN TECHNOLOGY CO., LTD. | Electronic Technology |
Entreprise privées | 4 |
---|---|
Huatian Technology (Kunshan) Electronics Co. Ltd.
![]() Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | Electronic Technology |
Xiamen Yonghong Group Co. Ltd.
![]() Xiamen Yonghong Group Co. Ltd. SemiconductorsElectronic Technology Xiamen Yonghong Group Co., Ltd. manufactures and distributes semi conductor lead frames. It also provides precise tooling products. The company distributes products to United States and other European countries. Xiamen Yonghong Group is located in Xiamen, China | Electronic Technology |
Unisem Advanced Technologies Sdn. Bhd.
![]() Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | Electronic Technology |
FlipChip International LLC
![]() FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Electronic Technology |