Ingu Yin Chang
Directeur Général chez Vertical Circuits, Inc.
Profil
Ingu Yin Chang currently works at Vertical Circuits, Inc., as Chief Executive Officer from 2011.
Mr. Chang also formerly worked at LSI Corp., as Principal and Amkor Technology, Inc., as Vice President-Sales & Marketing.
Mr. Chang received his graduate degree from the University of California, Berkeley.
Postes actifs de Ingu Yin Chang
| Sociétés | Poste | Début |
|---|---|---|
Vertical Circuits, Inc.
 Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Directeur Général | 09/08/2011 |
Anciens postes connus de Ingu Yin Chang
| Sociétés | Poste | Fin |
|---|---|---|
| LSI CORP | Corporate Officer/Principal | - |
| AMKOR TECHNOLOGY, INC. | Sales & Marketing | - |
Formation de Ingu Yin Chang
| University of California, Berkeley | Graduate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Sociétés cotées | 1 |
|---|---|
| AMKOR TECHNOLOGY, INC. | Electronic Technology |
| Entreprise privées | 2 |
|---|---|
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Electronic Technology |
LSI Corp.
 LSI Corp. Electronic ComponentsElectronic Technology LSI Corp. designs, develops, and markets high-performance storage and networking semiconductors. Its products include custom and standard product integrated circuits that are used in disk drives, solid state drives, high-speed communications systems, computer servers, storage systems, and personal computers. The company was founded on November 6, 1980 and is headquartered in San Jose, CA. | Electronic Technology |
